Extended Deadline: March 31, 2020
Due to the Covid-19 pandemic, we accept new submissions until April 15, 2020. For more information contact email@example.com
COINS: IEEE International Conference on Omni-layer Intelligent systems
IoT | Artificial Intelligence | Machine Learning | Big Data | Cloud | Sensor | Embedded Systems | Computer Architecture | EDA
Vertical Topics (Health | Smart City | Automotive | Industry 4.0 | Agriculture)
The Intelligent Internet of Things (IoT) tsunami is affecting every aspect of our daily lives, ranging from smart cars, smart homes, smart cities, smart factories to smart health, and smart environments. Although IoT vastly expanded the possibilities to fulfill many of our needs, numerous challenges still should to be addressed in order to develop smart, consistent, suitable, safe, flexible and power-efficient systems. To enable this transformation and to better understand the untapped opportunities, the interdisciplinary landscape of IoT demands a large number of significant technological advancements in the hardware and software communities to come together and to synergize their efforts. COINS focuses on novel omni-layer techniques for smart IoT systems, by identifying new perspectives and highlighting impending research issues and challenges. In particular, this conference addresses all-important aspects of novel IoT technologies from Connected Devices, to Edge/Fog, Cloud, and application, covering manufacturing, materials, CMOS and beyond-CMOS devices, architecture, embedded systems, reconfigurable hardware, network, cloud, Omni-layer artificial intelligence and machine learning, big data, emerging applications, as well as human-machine interaction. COINS also discusses the associated challenges that need to be overcome for achieving the goal of accuracy, privacy, reliability and security. The three-day COINS event consists of a conference with plenary keynote speakers, invited papers, regular papers, panels, special hot-topic sessions, and workshops.